Sustainability and Cost Efficiency Drive Automation in OSAT...

Sustainability and Cost Efficiency Drive Automation in OSAT Assembly and Test Facilities

Veröffentlicht 2025-07-15 14:59:49

The global outsourced semiconductor assembly and test market was valued at USD 43.08 billion in 2024 and is forecast to grow at a CAGR of 7.8 percent between 2025 and 2034. This country-focused analysis highlights major OSAT contributors—namely the U.S., China, Germany, and others—with a spotlight on R&D leadership, national policy impact, and strategic positioning.

The U.S. contributed USD 10.7 billion in 2024, expanding at ~9.2 percent CAGR via CHIPS Act-backed investments aimed at revitalizing a domestic packaging and testing ecosystem. R&D initiatives have accelerated development of advanced packaging clusters supporting AI and quantum chips, reinforcing onshore capacity and national security goals. China’s OSAT base reached USD 6.6 billion in 2024 (11.4 percent CAGR), aligned to ‘Made in China 2025’ mandates—driven by policy incentives promoting vertical integration in chip-to-package to bring about self‑sufficiency.

Germany’s OSAT stood at USD 1.5 billion (7.7 percent CAGR), heavily influenced by the automotive industry’s stringent testing standards and investment in industrial 4.0 labs. Japan (USD 2.7 billion, CAGR 10.5 percent) and South Korea (USD 1.6 billion, CAGR 8.9 percent) represent technologically advanced hubs with strong R&D leadership, focusing on next‑gen fan‑out and heterogeneous integration.

National policy impact drives capacity decisions. The U.S. CHIPS subsidies are accelerating Amkor expansions and encouraging foundry/OSAT alliances. In China, strategic subsidies support firms like ASE Technology to build integrated packaging-tester clusters. Germany benefits from EU battery‑chip initiative funding. Japan and Korea continue to push R&D support through public-private consortia focused on packaging innovation.

Corporate strategies feature mergers, capacity expansions, and tech-driven competitive positioning. ASE is expanding its Malaysian packaging hub to support global AI chip demand . Amkor is gaining advantage from U.S. reshoring incentives and elevated market share for advanced AI packaging . Foxconn’s bid for UTAC shows strategic positioning in Southeast Asia to strengthen Singapore and Thailand hubs.Moreover, ASE's internal move to AMD EPYC and Instinct GPUs highlights AI-enabled backend infrastructure modernization.

Trends shaping this landscape include market share concentration among top players and need for deeper strategic positioning via tech differentiation, vertical integration, and global capacity balancing. R&D leadership is proving decisive: countries with stronger innovation hubs and policy support are gaining competitive edge.

Dominant players by market share: